Bondingmachinefor LCD Refurbishment

FOG/FOB bonding machines，

bonding equipment，

bonding machine，

FOB bonding machine，

bonder machine，

bonder equipment，

FOG/FOB bonding machine XCM71-A6

1、The definition of FOG/FOB bonding machine XCM71-A6:
FOG/FOB bonding machine referred to as "state machine" "hot press," using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct.
2、 About the application field of FOG/FOB bonding machine XCM71 - A6
FOG / FOB bonding equipment is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: television (TV), laptop computers (NOTE BOOK), liquid crystal display (MONITOR), Tablet PC (PAD ), LCD / LCM production enterprises.
3、About the working principle of FOG/FOB bonding machine XCM71 - A6
Working principle of FOG / FOB bonding equipment XCM71-A5 is to using heat pipe and pulse to heat , mainly applicable to capacitive touch screen (CTP), LCD module production and maintenance processes FPC, COF, TAB bonding combination with the LCD and PCB after attached a ACF. use head pressure, head temperature, bonding time, optical alignment system bonding with LCD FPC, ACF glue which is between the PCB so that it can conduct.
4、 About the FOG/FOB bonding machine XCM71 - A6's competitive advantage
6.1 Patent of sunsom(Patent No. ZL 201120120232.2): SUNSOM pressure system cylinder head structure can eliminate dead weight, pressure, minimum accuracy up to 0.1KG
6.2 Pressure head downward structure part USES the level 3 circuit control, according to quantitative production, manual production, production debugging needs to choose different control methods, has solved the past problem due to the different work mode press head downward inconvenience control .
6.3 Stepper, servo memory function and Automatically position the same amount of production equipment’s function used on the equipment subtly on the device solves any inconvenience caused by the big flat repeatedly move.
6.4 Own the qualification of equipment manufacturing enterprise in china which has a maximum size of flat panel display of FPD
5、About the basic parameters of FOG/FOB bonding machine XCM71 -A6
Input Power: AC220V 50-60Hz
Working pressure :0.4-0 .8 Mpa
Operating modes: 7-inch HMI
Dimensions: L2210 × W1730 × H1500 mm
The method of Heating: heating or pulse heating thermostat
The quantity of Fixture: 2 group X-Y-θ micrometer adjustable
Range of Temperature : RT-500 ℃
Control program: PLC controller
Body main material: Steel + baking varnish
The thermocouple: K type

Shenzhen Sunsom automatic equipment Co.,Ltd .

is a high-tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developed，

Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble-removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.